Automated Wafer-Level Probing Replaces Manual Bench Testing
Photonics foundries increasingly deploy automated wafer-level optical probing systems capable of testing hundreds of photonic integrated circuit dies per hour, moving beyond earlier manual bench setups that required a technician to individually align fiber probes for each device under test. This automation shift reflects the reality that photonic integrated circuit production volumes have grown to a scale that manual testing simply cannot economically support. Several leading test equipment vendors have disclosed automated wafer probing platform roadmaps targeting substantially higher throughput within the next two product generations across their entire automated wafer probing platform lineup.
Market Impact: PIC foundry capacity investment up 35%








