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Molded Underfill Material Market
The Molded Underfill Material Market is experiencing significant growth, driven by the rising demand for semiconductor packaging, technological advancements in flip chip packaging, and increasing miniaturization of electronic devices. The market is projected to reach USD 14.03 billion by 2035, expanding from USD 9 billion in 2025, at a CAGR of 6% over the forecast period.
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29094
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