Active Pressure Control Displaces Simple Isolation
Advanced etch and deposition processes hold chamber pressure within tight windows that change through a recipe, which requires a valve that modulates conductance continuously rather than one that simply opens or closes. Pendulum and throttle designs do that, and they carry control electronics, position feedback and calibration that isolation valves never needed. High aspect ratio etch for memory and gate-all-around logic have both increased the number of steps requiring it. Growth at 13.2% is half again the market rate of 8.8%, and the content is worth several times an equivalent isolation valve on the same tool.
Market Impact: Adds 6 vacuum process steps








