Interconnect failure quietly deciding which materials survive
Around 71% of prototype failures occur at the boundary between a stretchable conductor and a rigid component, where strain concentrates because a chip cannot deform. Materials that sidestep that boundary rather than resisting it are winning on grounds nobody publishes about, which is why liquid metal alloys grow at 21.9% despite offering no conductivity advantage. Suppliers competing on elongation figures are competing on a specification that does not determine whether a product reaches production at all. The gap persists because the problem sits between materials science and assembly engineering, so no discipline treats it as its own responsibility.
Market Impact: Consumes 62% of material volume








