Microvia Density Rapidly Expands Fiber Laser Demand
Plant operators across major PCB manufacturing programs are increasingly specifying fiber laser drilling systems rather than relying on standard CO2 configurations, since fiber laser platforms eliminate the thermal damage and tolerance drift risk that CO2 configurations still carry across high-density microvia drilling applications. This shift is reshaping manufacturer product roadmaps, since fiber laser platforms require more sophisticated beam delivery engineering than CO2 designs ever needed. Fiber laser platforms now account for an estimated 24 percent of new unit purchases completed across the industry to date. Suppliers lagging this shift risk losing the largest electronics contracts entirely.
Market Impact: 1.4x faster growth from microvia-driven orders








