Solvent-Free High-Speed Systems Displace Adhesive Dry-Bond Lines
Converters facing tightening VOC emission regulation are increasingly specifying solvent-free high-speed lamination systems that bond film layers without solvent-based adhesives, rather than the adhesive dry-bond lines that dominated the category when VOC emission standards were less stringent in prior decades. This shift commands meaningfully higher equipment investment than conventional dry-bond lines given the solvent-free adhesive chemistry and application system requirements involved. Equipment makers report solvent-free orders now outpacing adhesive dry-bond orders across nearly every major flexible packaging converter account, a clear reversal from just a few years earlier. Builders report this shift accelerating further next year. This dynamic also shapes the thermal film laminating machines market, valued by MMA at USD 0.9 billion in 2025 and expected to reach USD 1.71 billion by 2036.
Market Impact: Drives roughly 13% of demand








